Organic thin film transistor and manufacturing method thereof, array substrate

ABSTRACT

An organic thin film transistor, a manufacturing method thereof and an array substrate are provided. The manufacturing method of an organic thin film transistor includes: forming an organic semiconductor layer; partially sheltering the organic semiconductor layer, so that a sheltered region and an unsheltered region are formed on the organic semiconductor layer, the sheltered region corresponding to a region where an active layer of the organic thin film transistor needs to be formed; and doping the organic semiconductor layer, so that the organic semiconductor layer in correspondence with the sheltered region is not doped, and the organic semiconductor layer in correspondence with the unsheltered region is doped.

This application is a continuation of U.S. patent application Ser. No.14/799,739 filed Jul. 15, 2015, which claims priority to Chinese PatentApplication No. 201410784404.4 filed on Dec. 16, 2014. The presentapplication claims priority to and the benefit of the above-identifiedapplication and is incorporated herein in its entirety.

TECHNICAL FIELD

Embodiments of the present invention relate to an organic thin filmtransistor and a manufacturing method thereof, an array substrate.

BACKGROUND

In recent years, along with the discovery and development of organicsemiconductor materials, an organic thin film transistor device, inwhich an organic material instead of an inorganic material is used forcarrier transportation, has been prepared, and performance of the deviceis being promoted gradually. The fundamental structure and function ofan Organic Thin Film Transistor (OTFT) are basically the same as thoseof a traditional Thin Film Transistor (TFT), and the difference lies inthat, an organic semiconductor is used by it as the working substance.Regarding a traditional inorganic thin film transistor, it is a fieldeffect transistor of Metal Oxide Semiconductor (MOS) type, and itssemiconductor material is usually inorganic silicon. While an organicsemiconductor material is used in an organic thin film transistor toreplace an inorganic semiconductor material in MOS. As compared with anexisting amorphous silicon or polysilicon TFT, an OTFT has the followingfeatures. It has low processing temperature, usually below 180° C., sothat the energy consumption is decreased significantly, and it issuitable for flexible substrates. In addition, it also has greatlysimplified technological process, substantially reduced cost, widematerial sources, and big developing potentialities. It is possible forOTFTs to find applications in many electronic products, such as, activematrix displays, smart cards, labels for commodity price and inventoryclassification, large-area sensor arrays, etc.

As illustrated in FIG. 1, the construction of an organic thin filmtransistor in prior art includes a base substrate 10, a gate electrode11 located on the base substrate 10, a gate insulating layer 12 locatedon the gate electrode 11, a source electrode 13 and a drain electrode 14that are located on the gate insulating layer 12, and an organicsemiconductor active layer 15 located on the source electrode 13 and thedrain electrode 14. A photolithography process is usually used forformation of the organic semiconductor active layer 15 in prior art. Inthe photolithography process, formation of a channel of the organicsemiconductor layer is mainly achieved in such a way that the organicsemiconductor layer is patterned by using an etching method. But whenthe channel of the organic semiconductor layer is formed by using anetching method, a photoresist solvent for the etched layer will have aneffect on the channel, such as surface dissolution. In addition, channeledges after etch may be affected by an etching media, and for example,edge overetch, oxidation, injection of ions from sidewall or othereffect results. In general, such a processing method will affectperformance of the channel, and will lead to increasing of a leakagecurrent of the organic thin film transistor.

In summary, when an organic semiconductor layer is patterned by using anetching method in prior art, a photoresist solvent for the etched layerwill make an impact on the organic semiconductor layer, leading todegradation in performance of the organic thin film transistor device,and reduction in its service life.

SUMMARY

According to an embodiment of the present invention, there is provided amanufacturing method of an organic thin film transistor, which includesforming an organic semiconductor layer; partially sheltering the organicsemiconductor layer, so that a sheltered region and an unshelteredregion are formed on the organic semiconductor layer, wherein, thesheltered region corresponds to a region where an active layer of theorganic thin film transistor needs to be formed; and doping the organicsemiconductor layer, so that the organic semiconductor layer incorrespondence with the sheltered region is not doped, and the organicsemiconductor layer in correspondence with the unsheltered region isdoped.

According to another embodiment of the present invention, there isprovided an organic thin film transistor, which includes an organicsemiconductor layer including a doped region and a non-doped region, thenon-doped region corresponding to a region where an active layer of theorganic thin film transistor needs to be formed.

According to still another embodiment of the present invention, there isprovided an array substrate, which includes the above-mentioned organicthin film transistor.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to clearly illustrate the technical solution of the embodimentsof the invention, the drawings of the embodiments will be brieflydescribed in the following; it is obvious that the described drawingsare only related to some embodiments of the invention and thus are notlimitative of the invention.

FIG. 1 is a schematically sectional view illustrating a structure of anorganic thin film transistor in prior art;

FIG. 2 is a flowchart illustrating a manufacturing method of an organicthin film transistor provided by an embodiment of the invention;

FIG. 3 is a flowchart illustrating a manufacturing method of abottom-gate organic thin film transistor provided by an embodiment ofthe invention;

FIG. 4 is a schematic view illustrating a sectional structure of abottom-gate organic thin film transistor provided by an embodiment ofthe invention;

FIG. 5 is a schematic view illustrating a planar structure afterpatterning of an organic semiconductor layer in an organic thin filmtransistor provided by an embodiment of the invention;

FIG. 6 is a schematic diagram illustrating a electrical test before andafter doping of an organic semiconductor layer in an organic thin filmtransistor provided by an embodiment of the invention;

FIG. 7 to FIG. 8 are schematic views illustrating sectional structuresin the course of patterning an organic semiconductor layer of an organicthin film transistor with a metal mask provided by an embodiment of theinvention;

FIG. 9 to FIG. 10 are schematic views illustrating sectional structuresin the course of patterning an organic semiconductor layer of an organicthin film transistor with a photoresist mask provided by an embodimentof the invention;

FIG. 11 is a flowchart illustrating the manufacturing method of atop-gate organic thin film transistor provided by an embodiment of theinvention;

FIG. 12 is a schematic view illustrating the sectional structure of atop-gate organic thin film transistor provided by an embodiment of theinvention;

FIG. 13 is a schematic view illustrating the sectional structure of anorganic thin film transistor provided by an embodiment of the invention.

DETAILED DESCRIPTION

In order to make objects, technical details and advantages of theembodiments of the invention apparent, the technical solutions of theembodiment will be described in a clearly and fully understandable wayin connection with the drawings related to the embodiments of theinvention. It is obvious that the described embodiments are just a partbut not all of the embodiments of the invention. Based on the describedembodiments herein, those skilled in the art can obtain otherembodiment(s), without any inventive work, which should be within thescope of the invention.

According to embodiments of the invention, there are provided an organicthin film transistor and manufacturing method thereof, an arraysubstrate and a display device, for achieving such a goal that use of anetching method is not required when an organic semiconductor layer ofthe organic thin film transistor is patterned, and in turn, performanceof the organic thin film transistor is enhanced.

The manufacturing method of an organic thin film transistor provided byembodiments of the present invention will be introduced below in detailin conjunction with attached drawings.

As illustrated in FIG. 2, according to an embodiment of the invention,there is provided a manufacturing method of an organic thin filmtransistor, which includes forming an organic semiconductor layer. Afterforming the organic semiconductor layer, the method further includes thefollowing steps S201 and S202.

S201, the organic semiconductor layer is partially sheltered, so that asheltered region and an unsheltered region are formed on the organicsemiconductor layer, wherein, the sheltered region corresponds to aregion where an active layer of the organic thin film transistor needsto be formed;

S202, the organic semiconductor layer is doped, so that the organicsemiconductor layer in correspondence with the sheltered region is notdoped, and the organic semiconductor layer in correspondence with theunsheltered region is doped.

For example, the region of the active layer of the organic thin filmtransistor in embodiments of the invention includes a channel zonelocated between a source electrode and a drain electrode of the organicthin film transistor, a zone where the source electrode contacts withthe organic semiconductor layer, and a zone where the drain electrodecontacts with the organic semiconductor layer.

The organic thin film transistor manufactured by embodiments of theinvention may be a bottom-gate organic thin film transistor, and mayalso be a top-gate organic thin film transistor.

First Embodiment

As illustrated in FIG. 3, the manufacturing method of an organic thinfilm transistor provided by an embodiment of the invention includes thefollowing steps S301-S306.

S301, a gate electrode is formed on a base substrate by a patterningprocess;

S302, a gate insulating layer is formed on the gate electrode;

S303, a source electrode and a drain electrode are formed on the gateinsulating layer by a patterning process;

S304, an organic semiconductor layer is formed on the source electrodeand the drain electrode;

S305, the organic semiconductor layer is partially sheltered, so as toform a sheltered region and an unsheltered region on the organicsemiconductor layer, wherein, the sheltered region corresponds to aregion where an active layer of the organic thin film transistor needsto be formed;

S306, the organic semiconductor layer is doped, so that the organicsemiconductor layer in correspondence with the sheltered region is notdoped, and the organic semiconductor layer in correspondence with theunsheltered region is doped.

For example, the organic thin film transistor manufactured by the abovemethod according to embodiments of the invention is illustrated in FIG.4. Firstly, a gate electrode 41 is formed on a base substrate 40 by apatterning process, and the base substrate 40 in embodiments of theinvention may be a glass substrate, and may also be a plastic substrateor a substrate coated with an insulating layer. The patterning processin embodiments of the invention refers to a photolithographic processincluding photoresist coating, exposure and development, an etchingprocess and a photoresist removing process after the etch. Theexemplified process of producing the gate electrode 41 by a patterningprocess in embodiments of the invention is that, a layer of a gate thinfilm is deposited on a base substrate 40 by thermal evaporation orsputtering, and for example, metal, indium tin oxide (ITO), dopedsilicon, an organic conductor or the like may be chosen for the gatethin film. For example, a metallic material, such as metal aluminum(Al), may be chosen for the gate thin film in embodiments of theinvention. The thickness of the deposited gate thin film in embodimentsof the invention may be in the range of 20 micrometers (nm) to 200 nm.Embodiments of the invention do not set a limit to thickness of the gatethin film, and in the actual production process, it can be adjustedaccording to specific technological requirements. A layer of photoresistis coated on the deposited gate thin film, and for example, the coatedphotoresist in embodiments of the invention may be a positivephotoresist, next, light exposure at 365 nm is conducted on the positivephotoresist with a mask, then development is performed by using TetraMethyl Ammonium Hydroxide (TMAH) with a concentration of 2.38%, theexposed gate thin film is etched off by wet etching, and finally, theremaining photoresist is removed, thereby forming the gate electrode 41in the embodiment of the invention.

Next, a gate insulating layer 42 is formed on the gate electrode 41, andthe gate insulating layer 42 in embodiments of the invention is aninsulating thin film including silicon oxide (SiOx), silicon nitride(SiNx), a metal oxide, a metal nitride, an organic material or the like.For example, SiOx is chosen for the gate insulating layer in theembodiment of the invention, and specifically, according to anembodiment of the invention, by way of Plasma Enhanced Chemical VaporDeposition (PECVD), the SiOx is generated by reaction of hydrogenatedsilicon (SiH₄) gas with nitrogen oxide (N₂O) gas. Thickness of thedeposited gate insulating layer in embodiments of the invention is inthe range of 30 nm to 1000 nm. Embodiments of the invention do not set alimit to thickness of the gate insulating layer, and in the actualproduction process, it can be adjusted according to specifictechnological requirements.

After that, a source electrode 43 and a drain electrode 44 are formed onthe gate insulating layer 42 by a patterning process, and for example, alayer of a source/drain thin film is deposited on the base substratewith the gate insulating layer 42 deposited thereon by thermalevaporation or sputtering. Metal, ITO or the like may be chosen for thesource/drain thin film. For example, the source/drain thin film in theembodiment of the invention selects a metallic material, such as, metalgold (Au), silver (Ag), molybdenum (Mo), aluminum (Al), copper (Cu) orthe like. Thickness of the deposited source/drain thin film inembodiments of the invention is in the range of 20 nm to 300 nm.Embodiments of the invention do not set a limit to thickness of thesource/drain thin film, and in the actual production process, it can beadjusted according to specific technological requirements. A layer ofphotoresist is coated on the deposited source/drain thin film, and forexample, the coated photoresist in the embodiment of the invention is apositive photoresist, next, light exposure at 365 nm is conducted on thepositive photoresist with a mask, then development is performed by usingTMAH with a concentration of 2.38%, the exposed source/drain thin filmis etched off by way of wet etching, and finally, the remainingphotoresist is removed, thereby forming the source electrode 43 and thedrain electrode 44 in the embodiment of the invention.

Next, an organic semiconductor layer 45 is formed on the sourceelectrode 43 and the drain electrode 44, and the organic semiconductorlayer in the embodiment of the invention is of a small molecular or highmolecular polymer. For example, an organic semiconductor layer 45 isformed on the source electrode 43 and the drain electrode 44 by asolution method or vacuum evaporation method according to embodiments ofthe invention, and thickness of the formed organic semiconductor layerin embodiments of the invention is in the range of 10 nm to 200 nm.Embodiments of the invention do not set a limit to thickness of theorganic semiconductor layer, and in the actual production process, itcan be adjusted according to specific technological requirements.

After that, the organic semiconductor layer 45 is partially sheltered,so that a sheltered region 451 and an unsheltered region 452 are formedon the organic semiconductor layer. The sheltered region 451 correspondsto a region where an active layer of the organic thin film transistorneeds to be formed. After it is sheltered, the organic semiconductorlayer 45 is doped, so that the organic semiconductor layer incorrespondence with the sheltered region 451 is not doped, and theorganic semiconductor layer in correspondence with the unshelteredregion 452 is doped. For example, doping of the organic semiconductorlayer 45 according to embodiments of the invention includes that, theorganic semiconductor layer 45 is doped by a solution method or a vacuumevaporation method, and the dopant used when the organic semiconductorlayer 45 is doped in embodiments of the invention is an organic smallmolecule. For example, the organic small molecule in embodiments of theinvention is PAG (photoacid generator) or PBG (photobase generator). Asregards a zone of the organic semiconductor layer 45 that is doped, itsconductivity or mobility is decreased, and by this method, an organicthin film pattern or array may be formed, without the necessity ofetching the organic semiconductor layer 45. The result diagram afterdoping of the organic semiconductor layer 45 is illustrated in FIG. 5,and by this method, a plurality of organic thin film patterns 51 havinga semiconductor function is formed, and at the same time, an insulatingregion 52 that loses a semiconductor function is also formed. The regionwhere the organic thin film patterns 51 are located corresponds to anon-doped region of the organic semiconductor layer, and the insulatingregion 52 corresponds to a doped region of the organic semiconductorlayer.

In order to verity electrical effects of the organic semiconductor layerafter doping in embodiments of the invention, the inventor has carriedout some experimental verification, and the verification results areillustrated in FIG. 6. Organic thin film transistors of four differenttypes are prepared in the experiment, respectively. An organicsemiconductor layer in an organic thin film transistor of the first typeis not doped; an organic semiconductor layer in an organic thin filmtransistor of the second type is doped, and the doped organicsemiconductor layer is irradiated with ultraviolet light for one minute;an organic semiconductor layer in an organic thin film transistor of thethird type is also doped, and the doped organic semiconductor layer isirradiated with ultraviolet light for one minute firstly, and then issubjected to after-baking for 15 minutes at 80° C.; an organicsemiconductor layer in an organic thin film transistor of the fourthtype is also doped, and the doped organic semiconductor layer isirradiated with ultraviolet light for one minute, and then is subjectedto after-baking for 1 hour at 180° C. As can be seen from the drawing,the organic thin film transistor of the first type exhibits normaltransistor characteristics, the current of the organic thin filmtransistor of the second type is reduced by one order of magnituderelative to the current of the organic thin film transistor of the firsttype, the current of the organic thin film transistor of the third typeis further reduced, and the current of the organic thin film transistorof the fourth type is reduced to 10⁻¹⁰ to 10⁻¹¹ A. It is furtherverified by this experiment that, a doped organic semiconductor layer isreduced in conductivity or mobility, and exhibits an insulating feature.

In some examples, there are two methods of partially sheltering anorganic semiconductor layer and doping the organic semiconductor layerin embodiments of the invention, and they will be introduced below indetail in conjunction with attached drawings.

Method 1: as illustrated in FIG. 7, an organic semiconductor layer 45 ispartially sheltered by a metal mask 70, and a sheltered region 451 andan unsheltered region 452 are formed on the organic semiconductor layer,wherein, the region 451 that is sheltered by the metal mask 70corresponds to a region where an active layer of an organic thin filmtransistor needs to be formed.

As illustrated in FIG. 8, the organic semiconductor layer 45 is doped,as indicated by an arrow direction in the figure. Because there is themetal mask 70 lying over the sheltered region 451 of the organicsemiconductor layer, dopants are blocked by the metal mask 70 and cannotreach the sheltered region 451 of the organic semiconductor layer 45,and the organic semiconductor layer 45 in correspondence with thesheltered region 451 is not doped; while there is no metal mask 70 overthe unsheltered region 452 of the organic semiconductor layer 45, theorganic semiconductor layer 45 in correspondence with the unshelteredregion 452 is doped at this time. After doping, the metal mask 70 isremoved, and an organic thin film transistor in embodiments of theinvention can be formed.

Method 2: as illustrated in FIG. 9, a layer of photoresist 90 is coatedon an organic semiconductor layer 45. For example, the photoresist inembodiments of the invention is a fluorinated photoresist, and ispartially removed by exposure and development, and a photoresistcovering region (i.e. a sheltered region 451 of the organicsemiconductor layer 45) and a photoresist uncovering region (i.e. anunsheltered region 452 of the organic semiconductor layer 45) are formedon the organic semiconductor layer 45. The photoresist covering regioncorresponds to a region where an active layer of an organic thin filmtransistor needs to be formed.

As illustrated in FIG. 10, the organic semiconductor layer 45 is doped,as indicated by an arrow direction in the figure. For example, thedopant in embodiments of the invention is PAG. As regards thephotoresist covering region, because the photoresist 90 lies over theorganic semiconductor layer 45, the organic semiconductor layer 45 incorrespondence with this region is not doped; as regards the photoresistuncovering region, the organic semiconductor layer 45 in correspondencewith this region is doped. In embodiments of the invention, for the sakeof arousing the doping efficiency, after PAG doping is conducted on theorganic semiconductor layer 45, the organic semiconductor layer 45 issubjected to light exposure at 365 nm for one minute, next, after-bakingat 180° C. for one hour under nitrogen atmosphere, and then rinsing withPropylene Glycol Monomethyl Ether Acetate (PGMEA), so as to wash the PAGleftover on a surface of the organic semiconductor layer 45. Finally,the photoresist covering the organic semiconductor layer 45 is removed,thereby forming an organic thin film transistor in embodiments of theinvention.

The organic thin film transistor manufactured by using the firstembodiment of the invention is a bottom-gate organic thin filmtransistor. In addition, a source electrode and a drain electrode of theorganic thin film transistor formed by embodiments of the invention mayalso be located above an organic semiconductor layer, and themanufacturing process is similar to the method in the first embodiment,details being omitted here.

Second Embodiment

As illustrated in FIG. 11, the manufacturing method of an organic thinfilm transistor provided by embodiments of the invention includes thefollowing steps of S1001-S1009.

S1001, a light blocking layer is formed on a base substrate.

S1002, a buffer layer is formed on the light blocking layer.

S1003, an organic semiconductor layer is formed on the buffer layer.

S1004, the organic semiconductor layer is partially sheltered, and asheltered region and an unsheltered region are formed on the organicsemiconductor layer, wherein, the sheltered region corresponds to aregion where an active layer of an organic thin film transistor needs tobe formed.

S1005, the organic semiconductor layer is doped, so that the organicsemiconductor layer in correspondence with the sheltered region is notdoped, and the organic semiconductor layer in correspondence with theunsheltered region is doped.

S1006, a first insulating layer is formed on the doped organicsemiconductor layer.

S1007, a gate electrode is formed on the first insulating layer by apatterning process.

S1008, a second insulating layer is formed on the gate electrode.

S1009, a source electrode and a drain electrode are formed on the secondinsulating layer by a patterning process.

The organic thin film transistor manufactured by the above methodaccording to embodiments of the invention is illustrated in FIG. 12. Themethod includes that, a light blocking layer 110 is formed on a basesubstrate 40, and the exemplified manufacturing process of the lightblocking layer is the same as that in prior art, details being omittedhere. A buffer layer 11 is formed on the light blocking layer 110, andthe exemplified manufacturing process of the buffer layer 111 is thesame as that in prior art, details being omitted here. An organicsemiconductor layer 45 is formed on the buffer layer 111, and theexemplified manufacturing process of the organic semiconductor layer isthe same as that in first embodiment, details being omitted here. Theorganic semiconductor layer 45 is partially sheltered, and a shelteredregion 451 and an unsheltered region 452 are formed on the organicsemiconductor layer 45, wherein, the sheltered region 451 corresponds toa region where an active layer of the organic thin film transistor needsto be formed. The organic semiconductor layer 45 is doped, so that theorganic semiconductor layer 45 in correspondence with the shelteredregion 451 is not doped, and the organic semiconductor layer incorrespondence with the unsheltered region 452 is doped. The organicsemiconductor layer is partially sheltered in the second embodiment ofthe invention, and the method of doping the organic semiconductor layeris the same as that in the first embodiment, details being omitted here.A first insulating layer 112 is formed on the doped organicsemiconductor layer 45, and the exemplified manufacturing process of thefirst insulating layer is the same as that in prior art, details beingomitted here. A gate electrode 113 is formed on the first insulatinglayer 112 by a patterning process, and the exemplified manufacturingprocess of the gate electrode is the same as that in prior art, detailsbeing omitted here. A second insulating layer 114 is formed on the gateelectrode 113, and the exemplified manufacturing process of the secondinsulating layer is the same as that in prior art, details being omittedhere. A source electrode 115 and a drain electrode 116 are formed on thesecond insulating layer 114 by a patterning process, and the sourceelectrode 115 and the drain electrode 116 contact with the organicsemiconductor layer 45 through via holes, respectively. The exemplifiedmanufacturing processes of the source electrode 115 and the drainelectrode 116 as well as the via holes are the same as those in priorart, and details are omitted here.

The organic thin film transistor manufactured according to the secondembodiment of the invention is a top-gate organic thin film transistor.In addition, a source electrode and a drain electrode of the organicthin film transistor manufactured by embodiments of the invention mayalso be located below an organic semiconductor layer, and themanufacturing process is similar to the method in Embodiment 2, detailsbeing omitted here.

As illustrated in FIG. 13, according to an embodiment of the invention,there is further provided an organic thin film transistor manufacturedby using the above method of the first embodiment or the secondembodiment. The organic thin film transistor includes an organicsemiconductor layer 45, which includes a doped region 121 and anon-doped region 122 that corresponds to a region where an active layerof the organic thin film transistor needs to be formed.

For example, the conductivity of the doped region 121 is smaller thanthe conductivity of the non-doped region 122.

For example, as seen from a planar view, the non-doped region 121 issurrounded by the doped region 122, as illustrated in FIG. 5.

In addition, as can be seen with reference to FIG. 4 and FIG. 12, theorganic thin film transistor according to embodiments of the inventionfurther includes a gate electrode, a gate insulating layer, a sourceelectrode and a drain electrode, wherein, the gate electrode isseparated from organic semiconductor layer by the gate insulating layer,and the source electrode and the drain electrode are connected to thenon-doped region of the organic semiconductor layer. The relativeposition relationship between the gate electrode, the organicsemiconductor layer, the gate insulating layer, the source electrode andthe drain electrode in the thin film transistor according to embodimentsof the invention is not limited to the position relationship illustratedin FIG. 4 and FIG. 12, and can be arbitrarily adjusted according toactual needs.

According to some embodiments of the invention, there is furtherprovided an array substrate, which includes the organic thin filmtransistor according to any embodiment of the invention. For example, aplurality of organic thin film transistors is arranged in the form of anarray.

According to some embodiments of the invention, there is furtherprovided a display device, which includes the array substrate accordingto any embodiment of the invention.

In summary, according to embodiments of the invention, there is provideda new method of patterning an organic semiconductor layer of an organicthin film transistor. When patterning is performed by using the method,the organic semiconductor layer in correspondence with a shelteredregion corresponds to an organic semiconductor layer that is retainedafter etch in prior art, and the organic semiconductor layer incorrespondence with an unsheltered region corresponds to an organicsemiconductor layer that is removed by etch in prior art. As a result,when the organic semiconductor layer of the organic thin film transistoris patterned in embodiments of the invention, there is no need to use anetching method, and the process steps of etching can be decreased. Thus,the manufacturing process of the organic thin film transistor issimplified, and the manufacturing cost of the organic thin filmtransistor is reduced. Moreover, such a patterning effect that etchingsolvent or other industrial solvent is not used is achieved.Consequently, such a technical problem that a solvent or reaction ionaffects properties of an organic thin film during etch in prior art issolved. Further, an insulating region is formed at the edge of the zoneof an active layer of the organic thin film transistor manufactured inembodiments of the invention, and it is possible that the off-statecurrent of the organic thin film transistor is effectively reduced, andthe on/off ratio of the organic thin film transistor is enhanced.

The foregoing embodiments merely are exemplary embodiments of theinvention, and not intended to define the scope of the invention, andthe scope of the invention is determined by the appended claims.

The application claims priority of Chinese Patent Application No.201410784404.4 filed on Dec. 16, 2014, the disclosure of which isincorporated herein by reference in its entirety as part of the presentapplication.

The invention claimed is:
 1. A manufacturing method of an organic thinfilm transistor, comprising: forming an organic semiconductor layer;partially sheltering the organic semiconductor layer, so that asheltered region and an unsheltered region are formed on the organicsemiconductor layer, wherein, the sheltered region corresponds to aregion where an active layer of the organic thin film transistor isconfigured to be formed; and doping the organic semiconductor layer, sothat the organic semiconductor layer in correspondence with thesheltered region is not doped, and the organic semiconductor layer incorrespondence with the unsheltered region is doped, wherein, theunsheltered region of the organic semiconductor layer after being dopedhas a conductivity smaller than a conductivity of the non-doped regionof the organic semiconductor layer.
 2. The method according to claim 1,prior to the doping the organic semiconductor layer, further comprising:forming a gate electrode on a base substrate by a patterning process;forming a gate insulating layer on the gate electrode; and forming asource electrode and a drain electrode on the gate insulating layer by apatterning process, wherein, the doped organic semiconductor layer isformed on the source electrode and the drain electrode, and the sourceelectrode and the drain electrode are connected to a non-doped region ofthe organic semiconductor layer.
 3. The method according to claim 1,further comprising: forming a first insulating layer on the dopedorganic semiconductor layer; forming a gate electrode on the firstinsulating layer by a patterning process; forming a second insulatinglayer on the gate electrode; and forming a source electrode and a drainelectrode on the second insulating layer by a patterning process,wherein, the source electrode and the drain electrode are connected to anon-doped region of the organic semiconductor layer through via holes.4. The method according to claim 3, prior to the forming the organicsemiconductor layer, further comprising: forming a light blocking layeron a base substrate; and forming a buffer layer on the light blockinglayer.
 5. The method according to claim 1, wherein, the forming theorganic semiconductor layer comprises: forming the organic semiconductorlayer by a solution method or vacuum evaporation method.
 6. The methodaccording to claim 2, wherein, the partially sheltering the organicsemiconductor layer and the doping the organic semiconductor layercomprise: partially sheltering the organic semiconductor layer with ametal mask, so that the sheltered region and the unsheltered region areformed on the organic semiconductor layer, wherein, the region shelteredby the metal mask corresponds to the region where the active layer ofthe organic thin film transistor is configured to be formed; and dopingthe organic semiconductor layer, so that the organic semiconductor layerin correspondence with the sheltered region is not doped, and theorganic semiconductor layer in correspondence with the unshelteredregion is doped.
 7. The method according to claim 3, wherein, thepartially sheltering the organic semiconductor layer and the doping theorganic semiconductor layer comprise: partially sheltering the organicsemiconductor layer with a metal mask, so that the sheltered region andthe unsheltered region are formed on the organic semiconductor layer,wherein, the region sheltered by the metal mask corresponds to theregion where the active layer of the organic thin film transistor isconfigured to be formed; and doping the organic semiconductor layer, sothat the organic semiconductor layer in correspondence with thesheltered region is not doped, and the organic semiconductor layer incorrespondence with the unsheltered region is doped.
 8. The methodaccording to claim 2, wherein, the partially sheltering the organicsemiconductor layer and the doping the organic semiconductor layercomprise: coating a layer of photoresist on the organic semiconductorlayer, and removing a part of the photoresist by exposure anddevelopment, so that a photoresist covering region and a photoresistuncovering region are formed on the organic semiconductor layer,wherein, the photoresist covering region corresponds to the region wherethe active layer of the organic thin film transistor is configured to beformed; and doping the organic semiconductor layer, so that the organicsemiconductor layer in correspondence with the photoresist coveringregion is not doped, and the organic semiconductor layer incorrespondence with the photoresist uncovering region is doped; andremoving the photoresist at the photoresist covering region.
 9. Themethod according to claim 3, wherein, the partially sheltering theorganic semiconductor layer and the doping the organic semiconductorlayer comprise: coating a layer of photoresist on the organicsemiconductor layer, and removing a part of the photoresist by exposureand development, so that a photoresist covering region and a photoresistuncovering region are formed on the organic semiconductor layer,wherein, the photoresist covering region corresponds to the region wherethe active layer of the organic thin film transistor is configured to beformed; doping the organic semiconductor layer, so that the organicsemiconductor layer in correspondence with the photoresist coveringregion is not doped, and the organic semiconductor layer incorrespondence with the photoresist uncovering region is doped; andremoving the photoresist at the photoresist covering region.
 10. Themethod according to claim 8, wherein, the photoresist is a fluorinatedphotoresist.
 11. The method according to claim 9, wherein, thephotoresist is a fluorinated photoresist.
 12. The method according toclaim 1, wherein, the doping the organic semiconductor layer comprisesdoping the organic semiconductor layer by a solution method or vacuumevaporation method.
 13. The method according to claim 12, wherein, adopant used for doping the organic semiconductor layer is an organicsmall molecule.
 14. The method according to claim 1, wherein, theunsheltered region of the organic semiconductor layer is formed into aninsulating region after being doped.